recipes/rc2014/selfhost: complete instructions
I have yet to test the whole process on real hardware. Soon.
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@ -6,31 +6,60 @@ either for another RC2014 or for an OS upgrade.
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## Gathering parts
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* stage4 from `sdcard` recipe. If you want to write to EEPROM as the final step,
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you'll need a hybrid stage4 that also includes stuff from the `eeprom` recipe.
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* stage3 from `sdcard` recipe. If you want to write to EEPROM as the final step,
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you'll need a hybrid stage3 that also includes stuff from the `eeprom` recipe.
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## Building stage 1
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### Part 1
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Building the first part of stage 1 (the binary part, before the inlined-source
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part) from within Collapse OS is actually very similar from building it from a
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modern environment. If you take the time to look at the base recipe `Makefile`,
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you'll see `cat xcomp.fs | $(STAGE2)`. That command builds part 1. Open
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Build Collapse OS' stage 1 from within Collapse OS is very similar to how we do
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it from the makefile. If you take the time to look at the base recipe
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`Makefile`, you'll see `cat xcomp.fs | $(STAGE2)`. That's the thing. Open
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`xcomp.fs` in a text editor and take a look at it.
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To assemble stage 1 from RC2014, all you need to do is to type those commands
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in the same order, and replace the `H@ 256 /MOD 2 PC! 2 PC!` lines with `H@ .X`.
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Those commands will inform you of the begin/end offsets of the assembled binary.
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The meaning of these commands is not explained here. You are encouraged to read
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the in-system documentation for more information.
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I'm not going to explain in detail what each command do, but only give you an
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overview of what is happening. You are encouraged to read the in-system
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documentation for more information.
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However, one thing you should know is that because the SD card driver is a bit
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slow, some of these commands take a long time. Multiple minutes. Be patient.
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The first part is configuration of your new system. When RAM starts, where RSP
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starts, what ports to use for what device, etc. These configuration declarations
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are expected in the boot code and driver code.
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Then, we load the Z80 assembler and the cross compiler (xcomp for short), which
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we'll of course need for the task ahead.
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Then come xcomp overrides, which are needed for xcomp to be effective.
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At this point, we're about to begin spitting binary content, so we want to know
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where we're at. That's why you'll need to type `H@ .X` and write down the
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result. That's the starting offset.
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Then, we assemble the boot binary, drivers' native words, then inner core,
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close the binary with a hook word. We're finished with cross-compiling.
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We're at the offset that will be `CURRENT` on boot, so we update `LATEST`.
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Then, we spit the course code that will be interpreted by stage 1 on boot so
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that it bootstraps itself to a full interpreter. Not all units are there
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because they don't fit in 8K, but they're sufficient for our needs. We also
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need the linker so that we can relink ourselves to stage 2.
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Finally, we have initialization code, then a spit of the ending offset.
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Go ahead, run that. However, one thing you should know is that because the SD
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card driver is a bit slow, some of these commands take a long time. Multiple
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minutes. Be patient.
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Once all your commands are run and that you have your begin/end offset (write
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them down somewhere), you're ready to assemble part 2.
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them down somewhere), you're at the same point as you were after the `make`
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part of the base recipe. The contents between your start and end offset is the
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exact same as the contents of `stage1.bin` when you run `make`. Continue your
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deployment from there.
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Good luck!
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### What to do on SDerr?
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@ -48,7 +77,3 @@ You're looking at the offset of the last wordref of the *previous* LOAD
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operation. That offset is going in `XCURRENT`. Then, you're looking at the end
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of that word. That offset goes in `HERE`. Once you've done that, relaunch your
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LOAD.
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### Part 2
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TODO
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